| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an IC card or an IC tag for improving variations of production speeds, defect rates and electrical qualities. <P>SOLUTION: A manufacturing method of an IC card or an IC tag having a process of layering and applying continuous heat lamination while winding off a plurality of web-like films wound in a roll shape uses web-like biaxially oriented polyester films in which a thermal adhesive layer is formed in advance by co-extrusion as web-like films and manufactures the IC card or the IC tag by an adhesive process using a laminate roll without having a press process. <P>COPYRIGHT: (C)2008,JPO&INPIT |
