GOLD-TIN-INDIUM SOLDER FOR PROCESSING COMPATIBILITY WITH LEAD-FREE TIN-BASED SOLDER

摘要

Disclosed in this specification is a lead-free soldering alloy made of gold, tin and indium. The tin is present in a concentration of 17.5% to 20.5%, the indium is present in a concentration of 2.0% to 6.0% and the balance is gold and the alloy has a melting point between 290° C. and 340° C. and preferably between 300° C. and 340° C. The soldering alloy is particularly useful for hermetically sealing semiconductor devices since the melting temperature is sufficiently high to permit post-seal heating and sufficiently low to allow sealing of the semiconductor without causing damage.