SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to prevent a warpage by including an aluminum oxide template. CONSTITUTION: A substrate includes a first surface and a second surface which face each other. A first ground pattern(17bc,17bl) is arranged on the first surface. A second ground pattern(15bc,15bl) is arranged on the second surface. Ground vias(11b) connects the first ground pattern to the second ground pattern. A first aluminum oxide layer is interposed between the ground vias.