发明名称 |
Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus |
摘要 |
A method of manufacturing a semiconductor apparatus according to the invention includes the steps of: coating solder 31 on an predetermined area in the upper surface of lead frame 30; mounting chip 32 on solder 31; melting solder 31 with hot plate 33 for bonding chip 32 to lead frame 30; wiring with bonding wires 34; turning lead frame 30 upside down; placing lead frame 30 turned upside down on heating cradle 35; coating solder 36, the melting point of which is lower than the solder 31 melting point; mounting electronic part 37 on solder 36; and melting solder 36 with heating cradle 35 for bonding electronic part 37 to lead frame 30. The bonding with solder 36 is conducted at a high ambient temperature. The semiconductor apparatus and the manufacturing method thereof facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps. |
申请公布号 |
EP2477223(A2) |
申请公布日期 |
2012.07.18 |
申请号 |
EP20110195847 |
申请日期 |
2011.12.28 |
申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
KATSUKI, TAKASHI |
分类号 |
H01L23/495;F02P3/045;H01L23/16;H01L25/16 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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