发明名称 Multilayered wiring board and method for fabricating the same
摘要 In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107, in the plurality of laminated insulating layers 104, 106, 107, the insulating layer 106 disposed at a laminating center in a laminating direction is made to constitute an insulating layer with a reinforcing member including a reinforcing member.
申请公布号 US8222527(B2) 申请公布日期 2012.07.17
申请号 US20060509723 申请日期 2006.08.25
申请人 NAKAMURA JUNICHI;KOBAYASHI YUJI;YAMAGIWA MIKIO;SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 NAKAMURA JUNICHI;KOBAYASHI YUJI;YAMAGIWA MIKIO
分类号 H05K1/03;H05K3/36 主分类号 H05K1/03
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