发明名称 Process of forming an electronic device including an integrated circuit with transistors coupled to each other
摘要 An electronic device, including an integrated circuit, can include a buried conductive region and a semiconductor layer overlying the buried conductive region, wherein the semiconductor layer has a primary surface and an opposing surface lying closer to the buried conductive region. The electronic device can also include a first doped region and a second doped region spaced apart from each other, wherein each is within the semiconductor layer and lies closer to primary surface than to the opposing surface. The electronic device can include current-carrying electrodes of transistors. A current-carrying electrode of a particular transistor includes the first doped region and is a source or an emitter and is electrically connected to the buried conductive region. Another current-carrying electrode of a different transistor includes the second doped region and is a drain or a collector and is electrically connected to the buried conductive region.
申请公布号 US8222695(B2) 申请公布日期 2012.07.17
申请号 US20090495250 申请日期 2009.06.30
申请人 LOECHELT GARY H.;GRIVNA GORDON M.;SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 发明人 LOECHELT GARY H.;GRIVNA GORDON M.
分类号 H01L29/66 主分类号 H01L29/66
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