发明名称 |
Stackable via package and method |
摘要 |
A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns. |
申请公布号 |
US8222538(B1) |
申请公布日期 |
2012.07.17 |
申请号 |
US20090483913 |
申请日期 |
2009.06.12 |
申请人 |
YOSHIDA AKITO;DREIZA MAHMOUD;ZWENGER CURTIS MICHAEL;AMKOR TECHNOLOGY, INC. |
发明人 |
YOSHIDA AKITO;DREIZA MAHMOUD;ZWENGER CURTIS MICHAEL |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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