发明名称 Process for manufacturing a copper compatible chalcogenide phase change memory element and corresponding phase change memory element
摘要 A copper-diffusion plug 21 is provided within a pore in dielectric layer over a copper signal line. By positioning the plug below a chalcogenide region, the plug is effective to block copper diffusion upwardly into the pore and into the chalcogenide region and thus to avoid adversely affecting the electrical characteristics of the chalcogenide region.
申请公布号 US8222627(B2) 申请公布日期 2012.07.17
申请号 US20080174462 申请日期 2008.07.16
申请人 KUO CHARLES;KIM YUDONG;STMICROELECTRONICS S.R.L 发明人 KUO CHARLES;KIM YUDONG
分类号 H01L45/00;H01L21/00 主分类号 H01L45/00
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