发明名称 |
Backlight module and light emitting diode module thereof |
摘要 |
A light emitting diode contains a package structure and a light emitting diode die embedded in the package structure. The package structure has an elliptic bottom surface having a semi-major axes and a semi-minor axis and a semi-ellipsoidal surface connecting and surrounding the edge of the elliptic bottom surface, wherein the maximum height of the ellipsoidal surface from the elliptic bottom surface is between the semi-major axes and the semi-minor axis. |
申请公布号 |
US8222664(B2) |
申请公布日期 |
2012.07.17 |
申请号 |
US20090482721 |
申请日期 |
2009.06.11 |
申请人 |
YAO YUAN-JUNG;TSAI SHAU-YU;TIEN YUN-YI;WANG CHIH-LIN;AU OPTRONICS CORPORATION |
发明人 |
YAO YUAN-JUNG;TSAI SHAU-YU;TIEN YUN-YI;WANG CHIH-LIN |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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