| 摘要 |
PURPOSE: An LED package and a manufacturing method thereof are provided to improve productivity of the LED package by omitting or reducing the number of process of wire bonding. CONSTITUTION: An LED chip(120) comprises a p-type electrode(121) and an n-type electrode(122). The p-type electrode is located on a p-type semiconductor layer. The n-type electrode is located on an n-type semiconductor layer. A sub mount(110) comprises a conductive pattern(112), a first electrode pad(114a), and a second electrode pad(114b). Both ends of the conductive pattern are respectively connected with the first electrode pad and the second electrode pad. A bump(130) interlinks the n-type electrode and the conductive pattern. The conductive pattern comprises transparent metal or a metallic oxide.
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