发明名称 |
Solid-state image pickup device, method of manufacturing the same and electronic apparatus |
摘要 |
Disclosed herein is a solid-state image pickup device including: a trench formed in an insulating film above a light-receiving portion; a first waveguide core portion provided on an inner wall side of the trench; a second waveguide core portion filled in the trench via the first waveguide core portion; and a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.
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申请公布号 |
US8222705(B2) |
申请公布日期 |
2012.07.17 |
申请号 |
US20100775830 |
申请日期 |
2010.05.07 |
申请人 |
OGINO AKIKO;SAYAMA YUKIHIRO;SHOYA TAKAYUKI;SHIMOJI MASAYA;SONY CORPORATION |
发明人 |
OGINO AKIKO;SAYAMA YUKIHIRO;SHOYA TAKAYUKI;SHIMOJI MASAYA |
分类号 |
H01L29/76;H01L27/14;H01L27/146;H01L29/94;H01L31/062;H01L31/113;H01L31/119;H04N5/335;H04N5/361;H04N5/369;H04N5/372 |
主分类号 |
H01L29/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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