| 发明名称 |
Bond pad with integrated transient over-voltage protection |
| 摘要 |
In various embodiments, the invention relates to bond pad structures including planar transistor structures operable as over-voltage clamps. |
| 申请公布号 |
US8222698(B2) |
申请公布日期 |
2012.07.17 |
| 申请号 |
US20100686003 |
申请日期 |
2010.01.12 |
| 申请人 |
SALCEDO JAVIER;RIGHTER ALAN;ANALOG DEVICES, INC. |
发明人 |
SALCEDO JAVIER;RIGHTER ALAN |
| 分类号 |
H01L23/62;H01L23/48;H01L23/52;H01L23/58;H01L29/40 |
主分类号 |
H01L23/62 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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