EPOXY RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE

摘要

PURPOSE: An epoxy resin composition is provided to have excellent flow-resistance and high adhesion with metal at high temperature. CONSTITUTION: An epoxy resin composition comprises: an epoxy resin containing two or more epoxy groups in one molecule; a curing agent; and a benzophenone derivative having one or more phenolic hydroxy groups in one molecule. The content of the benzophenone derivative having one or more phenolic hydroxy group is 0.1-1.0 weight%. The epoxy resin composition additionally comprises a silane compound, a curing accelerator, and/or inorganic filler.