发明名称 |
WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL |
摘要 |
A novel three dimensional wafer stack and the manufacturing method therefor are provided. The three dimensional wafer stack includes a first wafer having a first substrate and a first device layer having thereon at least one chip, a second wafer disposed above the first wafer and having a second substrate, and at least one pedestal arranged between and extending from the first substrate to the second substrate. The pedestal arranged in the device layer is used for preventing the low-k materials existing in the device layer from being damaged by the stresses.
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申请公布号 |
US2012178212(A1) |
申请公布日期 |
2012.07.12 |
申请号 |
US201213424926 |
申请日期 |
2012.03.20 |
申请人 |
CHANG CHI-SHIH;TAIN RA-MIN;LIAU SHYI-CHING;LO WEI-CHUNG;LEE RONG-SHEN;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHANG CHI-SHIH;TAIN RA-MIN;LIAU SHYI-CHING;LO WEI-CHUNG;LEE RONG-SHEN |
分类号 |
H01L21/98 |
主分类号 |
H01L21/98 |
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