发明名称 |
HIGHLY TRANSPARENT, THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED MATERIAL |
摘要 |
Provided is a thermally conductive silicone composition capable of producing a cured material, the material combining thermal conductivity, transparency, and flame resistance. This composition includes a hydrophobized surface-treated silica comprising: matrix silica composed of SiO1/2 units (Q units), and a surface treatment agent applied and bonded to the surface of the matrix silica. The surface treatment agent is an organosilicon compound represented by general formula (X) (in the formula, R1 either is a monovalent organosiloxane group optionally having a trifunctional branch but not having a tetrafunctional branch, the end group bonded to a silicon atom in the organosiloxane group being blocked by an oxygen atom, or is a substituted or unsubstituted monovalent hydrocarbon group; R2 is an alkyl group; and x is an integer 1 to 3). The molar ratio (p/q) of the number (p) of silicon atoms constituting the surface treatment agent bonded to the surface of the matrix silica in relation to the number (q) of the Q units is in the range 0.01 to 0.3. |
申请公布号 |
WO2012093602(A1) |
申请公布日期 |
2012.07.12 |
申请号 |
WO2011JP79907 |
申请日期 |
2011.12.22 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD.;ISHIHARA, YASUHISA;ENDO, AKIHIRO;TSUJI, KENICHI |
发明人 |
ISHIHARA, YASUHISA;ENDO, AKIHIRO;TSUJI, KENICHI |
分类号 |
C08L83/04;C08K9/06;C08L83/05;C08L83/07 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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