发明名称 |
Dummy Metal Design for Packaging Structures |
摘要 |
A method of forming an integrated circuit structure is provided. The method includes forming a metal pad at a major surface of a semiconductor chip, forming an under-bump metallurgy (UBM) over the metal pad such that the UBM and the metal pad are in contact, forming a dummy pattern at a same level as the metal pad, the dummy pattern formed of a same metallic material as the metal pad and electrically disconnected from the metal pad, and forming a metal bump over the UBM such that the metal bump is electrically connected to the UBM and no metal bump in the semiconductor chip is formed over the dummy pattern. |
申请公布号 |
US2012178252(A1) |
申请公布日期 |
2012.07.12 |
申请号 |
US201213427430 |
申请日期 |
2012.03.22 |
申请人 |
LIU TZUAN-HORNG;HOU SHANG-YUN;JENG SHIN-PUU;WU WEI-CHENG;WEI HSIU-PING;CHEN CHIH-HUA;KUO CHEN-CHENG;CHEN CHEN-SHIEN;TSENG MING HUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIU TZUAN-HORNG;HOU SHANG-YUN;JENG SHIN-PUU;WU WEI-CHENG;WEI HSIU-PING;CHEN CHIH-HUA;KUO CHEN-CHENG;CHEN CHEN-SHIEN;TSENG MING HUNG |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|