| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a print circuit board resin composition capable of producing a prepreg having excellent impregnating ability to a base material, low thermal expansion, excellent drill processability and excellent reliability, a prepreg produced by the above-described print circuit board resin composition, a laminate sheet produced by use of the above-described print circuit board resin composition or prepreg, a print circuit board produced by use of at least one of the above-described laminate sheet, prepreg and print circuit board resin composition, and a semiconductor device having superior performance and produced by use of the print circuit board. <P>SOLUTION: A print circuit board resin composition includes a zirconium compound. <P>COPYRIGHT: (C)2012,JPO&INPIT |
