| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate attaching structure which can suppress an occurrence of a stress failure such as a break of a lead and solder cracking in an electronic component of a slave substrate when fully potting a resin. <P>SOLUTION: The substrate attaching structure which attach a slave substrate 21 to a master substrate 11 comprises: attaching holes 12 which are provided in the master substrate 11 and attach the slave substrate 21; and attachment parts 22 which are provided on the slave substrate 21 and are attached on the attaching holes 12 in the master substrate 11. The attaching hole 12 of the master substrate 11 has a through-hole plating 14 applied thereon and a land 15 having both sides provided thereon. Strength of connecting the attaching hole 12 of the master substrate 11 with the attachment part 22 of the slave substrate 21 by soldering increases, and accordingly the occurrence of the stress failure such as the break of the lead and the solder cracking can be suppressed during resin full-potting. <P>COPYRIGHT: (C)2012,JPO&INPIT |
