MECHANISMS FOR EFFICIENT INTRA-DIE/INTRA-CHIP COLLECTIVE MESSAGING

摘要

Mechanism of efficient intra-die collective processing across the nodelets with separate shared memory coherency domains is provided. An integrated circuit die may include a hardware collective unit implemented on the integrated circuit die. A plurality of cores on the integrated circuit die is grouped into a plurality of shared memory coherence domains. Each of the plurality of shared memory coherence domains is connected to the collective unit for performing collective operations between the plurality of shared memory coherence domains.