| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device (in particular, a microphone) having a small mount area. <P>SOLUTION: A package is formed by vertically overlapping a cover 44 and a substrate 45. A microphone chip 42 is mounted on a top surface of a recessed part 46 of the cover 44, and a circuit element 43 is mounted on an upper surface of a recessed part 66 of the substrate 45. The microphone chip 42 is positioned vertically above the circuit element 43. The microphone chip 42 is connected with a bonding pad provided at a lower surface of the cover 44 through a bonding wire, and the circuit element 43 is connected with a bonding pad 68 provided at an upper surface of the substrate 45 through a bonding wire 80. A cover side join part 49, establishing electrical continuity with the bonding pad at the lower surface of the cover 44, is joined to a substrate side join part 69, establishing electrical continuity with the bonding pad 68 at the upper surface of the substrate 45, through a conductive material 86. <P>COPYRIGHT: (C)2012,JPO&INPIT |
