| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a thermal characteristic of an LED package and form a reflective surface capable of exhibiting reflective performance at low costs. <P>SOLUTION: An LED package substrate is a laminated body in which metal foils are bonded each other on a flat metal plate with an insulating layer sandwiched therebetween and consisting of polyimide or polyamide-imide resin layer. In the metal foil, a pair of wiring enlarged parts insulated each other by a slit, a pair of external electrode connection parts, and a wiring part to interconnect therebetween are integrally formed, and the wiring enlarged part having a width in the slit direction being larger than that of the wiring part is configured that its width is wider than the length of the long side of an LED chip. A top part of the wiring enlarged part is subjected to a metallic surface treatment acting as a reflective member. Connection electrodes are connected to each of wiring enlarged parts by mounting LED chips. A transparent resin is filled so as to contain at least LED chips and their electrode connection parts. <P>COPYRIGHT: (C)2012,JPO&INPIT |
