发明名称 Chemical Mechanical Polishing Pad with Non-directional and Non-uniform Surface Roughness
摘要 PURPOSE: A polishing pad with non-directional and non-uniform surface roughness, and a manufacturing method and apparatus for the same are provided to reduce the break-in time and surface defects in the initial stage of polishing. CONSTITUTION: A polishing pad manufacturing method is as follows. A polishing pad is attached to a rotary platen. A milling cutter is installed to contact the surface of the polishing pad and rotate. The platen and the milling cutter are rotated at the same time so that non-directional and non-uniform surface roughness is formed in the polishing pad.
申请公布号 KR101165440(B1) 申请公布日期 2012.07.12
申请号 KR20090067472 申请日期 2009.07.23
申请人 发明人
分类号 B24B37/26;B24B53/02;B23C3/00;B24B37/00;B24B37/24;B24D3/00 主分类号 B24B37/26
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