WIRING BOARD AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which makes it easy to use common devices for inspecting the both sides of the wiring board and common settings for the devices, and a semiconductor package in which a semiconductor chip is mounted on the above-described wiring board.

SOLUTION: The present wiring board includes a laminate in which a plurality of insulator layers and a plurality of wiring layers are alternately laminated one by one, and a solder resist layer formed so as to cover the wiring layer exposed on one side of the laminate. The insulation layer is exposed on the other side of the laminate and the solder resist layer is transparent or translucent pale yellow.

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