| 摘要 |
A method for manufacturing an interconnection wiring structure of a semiconductor device includes forming an isolation region, which arranges active regions in a diagonal direction, in a semiconductor substrate; forming first damascene trenches, which open upper portions of a bit line contacts, by selectively etching a second interlayer insulation layer; forming bit lines which fill the first damascene trenches; forming second damascene trenches, which expose portions of the active region, by selectively etching the portion of a second interlayer insulation layer between the bit lines and the portion of the first interlayer insulation layer thereunder; attaching trench spacer on side walls of the second damascene trench; and forming storage node contact lines which fill the second damascene trenches.
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