METHOD OF FABRICATING MULTILAYERED PRINTED CIRCUIT BOARD

摘要

A method of fabricating a multilayered printed circuit board, the method including: providing a core substrate having an outer circuit, the core substrate having a thermal expansion coefficient of 10 to 20 ppm/° C. at −60 to 150° C.; stacking a stress-relieving insulation layer on either side of the core substrate, the stress-relieving insulation layer having a thermal expansion coefficient of −20 to 6 ppm/° C.; and forming a metal layer on the insulation layer and forming at least one pad by removing at least one portion of the metal layer and electrically connecting the pad with the outer circuit.