发明名称 PLASMA CVD METHOD, METHOD FOR FORMING SILICON NITRIDE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A plasma processing apparatus generates plasma by introducing microwaves into a processing chamber by using a planar antenna having a plurality of slots. By using the plasma processing apparatus, a nitrogen containing gas and a silicon containing gas introduced into the processing chamber are brought into the plasma state, and at the time of depositing by using the plasma a silicon nitride film on the surface of the a substrate to be processed, stress to the silicon nitride film to be formed is controlled by the combination of the type and the processing pressure of the nitrogen containing gas.
申请公布号 US2012178268(A1) 申请公布日期 2012.07.12
申请号 US201213423783 申请日期 2012.03.19
申请人 KOHNO MASAYUKI;NISHITA TATSUO;NAKANISHI TOSHIO;TOKYO ELECTRON LIMITED 发明人 KOHNO MASAYUKI;NISHITA TATSUO;NAKANISHI TOSHIO
分类号 H01L21/318 主分类号 H01L21/318
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