| 摘要 |
PURPOSE: An active resin composition is provided not to need cleaning process of flux in surface mounting method, thereby capable of reducing production cost, and improving workability, and to able to improve reliability of products because bubbles, voids, etc are not absolutely remained on a spreading resin, and an underfill resin after curing. CONSTITUTION: An active resin composition comprises 1-50 parts by weight of a block carboxylic acid compound and/or 1-10 parts by weight of a carboxylic compound based on 100.0 parts by weight of an epoxy resin. The surface mounting method comprises a step of spreading the active resin composition on at least a part of surface of printed wiring board, a step of mounting surface-mounting components on a printed circuit board, and reflow soldering the same, a step of vacuum controlling and/or heating the spread active resin composition under curing-initiating temperature, and heat-curing the spread resin. |
