| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device capable of responding to multiple pins and having high reliability, and a semiconductor device circuit member for stably manufacturing such resin sealed semiconductor device. <P>SOLUTION: A resin sealed semiconductor device comprises a plurality of terminal parts arranged such that external terminal surfaces are aligned in the same plane, a semiconductor element electrically connected with an internal terminal surface of each terminal part by a wire, and a resin member encapsulating the terminal parts and the semiconductor element so as to expose at least a part of the external terminal surface of each terminal part outside. The terminal part is formed of a multilayer structure including two or more types of metals selected from Cu, Ni, Ag, Pd and Au. Protrusions are provided around a structure layer forming the internal terminal surface among structure layers of the multilayer structure and the protrusions engage with the resin member. <P>COPYRIGHT: (C)2012,JPO&INPIT |
