发明名称 WIRING BOARD AND METHOD OF PRODUCING THE SAME
摘要 A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the wiring board, an outer peripheral edge of the external connection pad is retracted from an outer peripheral edge of the surface plated layer toward a center of the external connection pad.
申请公布号 US2012175157(A1) 申请公布日期 2012.07.12
申请号 US201213427235 申请日期 2012.03.22
申请人 KANEKO KENTARO;SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 KANEKO KENTARO
分类号 H05K1/09;H05K1/11 主分类号 H05K1/09
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