| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve reduction of the tact time of a work process, while properly picking up and transferring a chip component. <P>SOLUTION: The component transfer device takes out a plurality of wafer-like chips held on a holding part by a suction nozzle. Acquiring means acquires position information on the chips on the holding part, subsequently updates the position information by acquiring the position information on first chips again before sucking the first chips out of the plurality of chips. Determining means (i) determines a moving amount for moving the first chips to a pickup position based on the position information on the first chips having been updated, and (ii) determines a moving amount for moving chips other than the first chips, which are held in a predetermined range based on the first chips on the holding part, to the pickup position based on corrected position information on which the position information before being updated and the position information after been updated of the first chips are corrected, with respect to position information on the chips other than the first chips. Moving means moves the chips to the pickup position based on the determined moving amount. <P>COPYRIGHT: (C)2012,JPO&INPIT |
