| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface mounted piezoelectric oscillator which facilitates size reduction. <P>SOLUTION: A surface mounted piezoelectric oscillator includes a piezoelectric vibration piece 2, an IC chip 3, and an insulation base 4 having a housing part in which electrode pads connecting with the IC chip are formed. Excitation electrodes, connection electrodes, and an extraction electrode are formed in the piezoelectric vibration piece. Multiple first connection terminals, which connect with the base and are arranged in two columns on one main surface, are formed at the IC chip, and at least a pair of second connection terminals, which connect with the piezoelectric vibration piece in the same column direction as the first connection terminals, are formed on the other main surface. The electrode pads of the housing part of the base are joined to the first connection terminals of the IC chip via metal bumps using a flip chip bonding method. The second connection terminals of the IC chip are joined to the connection electrodes of the piezoelectric vibration piece via metal bumps using the flip chip bonding method. <P>COPYRIGHT: (C)2012,JPO&INPIT |
