| 摘要 |
The present invention provides a packaging for a fiber optic component, such as an optical fiber, wherein the heating induced strain to the fiber optic component is minimized, wherein the packaging comprises a first support member having a first coefficient of thermal expansion (k1). The packaging further comprises a second support member, which is resiliently mounted to the first support member for minimizing transfer of thermal expansion induced strain of the first support member to the second support member. The second support member comprises a longitudinal groove open at least on one side of the second support member for receiving a fiber optic component, wherein the second support member has a tensile strength considerably higher than that of the fiber optic component. The second support member has a second coefficient of thermal expansion (k2) substantially smaller than the first coefficient of thermal expansion (k1), wherein the first support member is adapted to exchange heat induced by free-space radiation. The second support member is made of material, such as quartz, which is transparent to the wavelengths used in the component. |
