发明名称 HEAT RADIATING PRINTED CIRCUIT BOAD UNIFIED BRACKET AND CHASSIS STRUCTURE HAVING THE SAME
摘要 The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit; and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit, where the circuit pattern unit includes a driving unit divided into a plurality of driving regions and at least one or more electrodes for supplying a power to the driving unit, and where, the mounting unit is arranged with an electrode line for connecting the driving unit and electrodes other than the electrode arranged on the circuit pattern unit, such that dimming and scanning functions can be performed whereby illumination can be finely controlled, the width of the circuit pattern unit can be narrowed and damage to the PCB caused by heat can be prevented.
申请公布号 KR101164976(B1) 申请公布日期 2012.07.12
申请号 KR20090097692 申请日期 2009.10.14
申请人 发明人
分类号 G02F1/1345 主分类号 G02F1/1345
代理机构 代理人
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