| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem that the heat from molten solder causes heat stress to an electronic component during flow soldering. <P>SOLUTION: An electronic component cooling jig 1 for flow soldering is used in a flow soldering device which connects a printed circuit board and the leads of a numeric display component electrically by soldering a solder to a soldering surface. The electronic component cooling jig 1 comprises a metal block 2, and a heat insulation cover 3 covering the entirety of the metal block 2 except the exposed surface on the side being mounted on the electronic component. The electronic component cooling jig 1 is mounted on the numeric display component and the numeric display component is cooled by the metal block 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
