发明名称 ELECTRONIC COMPONENT PACKAGING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To ensure stabilized attachment of an electronic component, high speed operation of an apparatus, and suppression of variation in the attachment position due to an external force or aging in an electronic component packaging apparatus having interlocked rotating shafts. <P>SOLUTION: A nozzle head 20 has a spindle 36 including a nozzle 18 for holding an electronic component, a T-axis motor 31 for rotating the spindle 36, a head body 34 having a separate rotation axis C1 parallel with the spindle 36 and interlocked with the spindle 36 to cause revolution around the rotation axis C1, and an R-axis motor 32 which rotates the head body 34. Rotation control means (an angular ball bearing 47) is provided in a transmission mechanism from the T-axis motor 31 to the spindle 36. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012134347(A) 申请公布日期 2012.07.12
申请号 JP20100285687 申请日期 2010.12.22
申请人 SAMSUNG TECHWIN CO LTD 发明人 KITADA SUSUMU
分类号 H05K13/04 主分类号 H05K13/04
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