| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel method for cleaving a substrate. <P>SOLUTION: A method for cleaving a substrate in order to separate a film (1') from the substrate (1), comprises the successive steps of: (i) forming a stress generation structure (2) locally connected to a surface of the substrate (1), and designed to inflate or deflate in a plane parallel to the surface of the substrate (1) by action of heat treatment; and (ii) applying heat treatment to the structure (2) designed to cause inflation or deflation to generate a plurality of local stress in the substrate (1), so that combination of the stress generates stress greater than mechanical strength of the substrate on a cleavage surface (C) parallel to the surface of the substrate defining the film (1') to be separated, and the stress results in cleavage of the substrate (1) across the surface (C). <P>COPYRIGHT: (C)2012,JPO&INPIT |
