METHOD FOR ENCAPSULATING A MICRO-COMPONENT

摘要

The invention relates to a method for encapsulating a micro-component (100) provided on a substrate (102), comprising the steps of: a) providing an electric contact stud (104) on the substrate; b) providing a portion of an expendable material (108) covering the micro-component and the electric contact stud; c) providing an encapsulation layer (110) covering the expendable material and the first surface of the substrate (101); d) providing, through the substrate, a hole (112) in alignment with the electric contact stud and opening at the portion of expendable material; e) removing the portion of expendable material through the hole; f) providing in the hole a conducting portion (122) electrically connected to the electric contact stud, providing a conducting via (113).