| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cuprous oxide particle dispersion useful for formation of copper wiring exhibiting high adhesion to a substrate. <P>SOLUTION: A cuprous oxide particle dispersion contains cuprous oxide particles, 5-50 wt% of glycerin for the cuprous oxide particles, and 10-90 wt% of polyethylene glycol for the cuprous oxide particles. The dispersion is used for forming wiring of an electric circuit. In particular, wiring is formed preferably on a polyimide flexible substrate. When the dispersion is used for forming wiring of an electric circuit on a polyimide flexible substrate by printing, heat treatment at the temperature of glass transition point of polyimide or lower is suitable for a coating film formed by printing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
