| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal gap pad which reduces a compression load in a thermal gap pad for conducting heat from a thermal supply component such as an electronic apparatus. <P>SOLUTION: A thermal assembly 100 includes: a thermal supply electronic component 114; a cooling structure 130; a thermal gap pad 140 having a first surface; and a lubricant agent 142 provided along the first surface of the thermal gap pad 140 and having viscosity of approximately 500 cP or less. The thermal gap pad 140 is compressed between the thermal supply electronic component 114 and the cooling structure 130, and the compression causes the first surface of the thermal gap pad 140 to make thermal contact with the cooling structure 130. <P>COPYRIGHT: (C)2012,JPO&INPIT |
