| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal mold which is improved in a filling property of resin to a thin resin molded product. <P>SOLUTION: The metal mold to be used for resin molding of a semiconductor mounting substrate 100 mounted with a plurality of semiconductor chips 30 includes: an upper die 50 configured so as to press the semiconductor mounting substrate 100 from the upper surface side; and a lower die 60 configured so as to press the semiconductor mounting substrate from the lower surface side. A cavity 57 into which a resin 20 is filled by resin molding is formed in at least one of the upper die 50 and the lower die 60. A recess 58 is formed at a position corresponding to a cutting portion of the semiconductor mounting substrate 100 is formed in the cavity 57, and the width of the recess 58 is equal to or smaller than the cut width of the semiconductor mounting substrate 100. <P>COPYRIGHT: (C)2012,JPO&INPIT |
