发明名称 |
Solder Joint Reflow Process for Reducing Packaging Failure Rate |
摘要 |
In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.
|
申请公布号 |
US2012175403(A1) |
申请公布日期 |
2012.07.12 |
申请号 |
US20110987702 |
申请日期 |
2011.01.10 |
申请人 |
YU CHEN-HUA;CHANG WEN-YAO;WANG CHIEN RHONE;ZUO KEWEI;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YU CHEN-HUA;CHANG WEN-YAO;WANG CHIEN RHONE;ZUO KEWEI;LIU CHUNG-SHI |
分类号 |
B23K31/02;B23K1/00 |
主分类号 |
B23K31/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|