| 摘要 |
PURPOSE: An optical device package of a film type and a manufacturing method thereof are provided to improve heat emitting effect by directly mounting an optical device in a circuit pattern layer of the lower side of an insulating film. CONSTITUTION: A via hole is formed in an insulating film(210). A circuit pattern layer is formed in the lower side of the insulating film. A light emitting device(150) is mounted on the upper side of the circuit pattern layer which is exposed by the via hole. The light emitting device is electrically connected to the circuit pattern layer. A molding unit(170) contains fluorescent material whiles while filling the light emitting device. A white solder resist layer is formed on the insulating film. Materials of the insulating film contain ceramic. A wire electrically connects an anode and cathode of an optical device to an anode and cathode of the circuit pattern layer through the via hole. |
