METHOD FOR FABRICATING SEMICONDUCTOR DEVICE PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide cost-effective semiconductor device packaging fabrication processes that overcome one or more disadvantages associated with current POL processes.

SOLUTION: The semiconductor device package fabrication processes include the steps of: providing a laminate comprising a dielectric film 120 disposed on a first metal layer 130; forming a plurality of vias 150 extending through the laminate according to a predetermined pattern; attaching at least one semiconductor device to the outer surface of the dielectric film such that the semiconductor device contacts the one or more vias after the attachment; forming an interconnect layer comprising the first metal layer and an electrically conductive layer; and patterning the interconnect layer according to a predetermined circuit configuration to form a patterned interconnect layer, where a portion of the patterned interconnect layer extends through the one or more vias to form an electrical contact with the semiconductor device.

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