SEMICONDUCTOR PACKAGE BOARD HAVING DUMMY AREA

摘要

PROBLEM TO BE SOLVED: To provide a dummy area-containing semiconductor package substrate where warpage of a semiconductor package substrate is prevented by forming a dummy area on the semiconductor package substrate and forming a first metal pattern and a second metal pattern on the two sides of the dummy area.

SOLUTION: The semiconductor package substrate includes a dummy area 10 where a polygonal first metal pattern 11 on one side and a polygonal second metal pattern 12 on the other side are alternately formed, in a portion to be removed after a semiconductor element is mounted.

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