发明名称 |
JIG PLATE AND METHOD FOR STACKING SEMICONDUCTOR DEVICE CHIP USING THE JIG PLATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a jig plate which can easily stack a plurality of semiconductor device chips corresponding to each of semiconductor devices formed on a semiconductor device wafer. <P>SOLUTION: In the jig plate which is used when a semiconductor device chip having a second semiconductor device formed thereon is stacked on each of first semiconductor devices of a semiconductor device wafer having the first semiconductor devices formed in each of regions that are partitioned by a plurality of crossing predetermined division lines, the jig plate has a reference pattern corresponding to the predetermined division lines of the semiconductor device wafer formed thereon. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012134233(A) |
申请公布日期 |
2012.07.12 |
申请号 |
JP20100283283 |
申请日期 |
2010.12.20 |
申请人 |
DISCO ABRASIVE SYST LTD |
发明人 |
KODAMA SHOICHI;KIM YONG SUK;MAEDA NOBUHIDE;KAWAI AKIHITO |
分类号 |
H01L21/673;H01L21/50;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/673 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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