| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sputtering device having a cylindrical target, which can adjust a T/M distance without stopping the operation of the sputtering device. <P>SOLUTION: The sputtering device for carrying out sputtering on a substrate includes: a chamber; a cylindrical target provided in the chamber; a magnet provided in the cylindrical target; a magnet supporting member supporting the magnet in the cylindrical target; and a magnet lifting rod connected to the magnet supporting member. By vertically moving the magnetic lifting rod by the magnetic lifting mechanism, the distance between the magnet and the inner wall of the cylindrical target can be changed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
