Printed circuit board for mounting integrated circuit in ball grid array package used in electronic device, has solder bump that is embedded into plastic socket formed on contacting surface, in state exposing surface region of solder bump

摘要

The printed circuit board has a contacting surface (2) that is formed on solder bump (3) made of plastic for making electrical contact with electronic components. Each solder bump is embedded into plastic socket formed on contacting surface, in a state exposing surface region (5) of solder bump, so that connected plastic layer (4) is formed.