| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transit-type inline vacuum processing apparatus, such as a sputtering apparatus, which has a mechanism capable of uniforming the distance between adjacent substrates and can control the mechanism, since the distance between substrates (between a preceding substrate and a succeeding substrate) that are continuous and adjacent to each other when depositing, has the effect on the conductance and also the gas pressure in a process chamber. <P>SOLUTION: The vacuum processing apparatus includes: the process chamber capable of reducing a pressure; a transport unit, provided in the process chamber, for transporting a plurality of substrates; a gas supply unit for supplying a gas to process the substrates in the process chamber; a substrate processing unit for processing the substrates placed on the transport unit; a detection unit for detecting a substrate interval between adjacent substrates out of the plurality of substrates; and a control unit for controlling, based on the substrate interval detected by the detection unit, a supply amount of the gas to be supplied by the gas supply unit. <P>COPYRIGHT: (C)2012,JPO&INPIT |
