COPPER OR COPPER ALLOY FOIL

摘要

PROBLEM TO BE SOLVED: To provide a copper foil or copper alloy foil which is prevented from being corroded under such a condition that it is exposed to moisture containing salinity and whose solder wettability is kept in a satisfactory state.

SOLUTION: The copper foil or copper alloy foil includes a thin film containing a phosphate represented by general formula (1) and having a thickness of 0.1-10 nm on one surface or both surfaces thereof. In the formula (1), R1represents a 4-30C saturated or unsaturated hydrocarbon group, R2represents a lower alkylene group, n is an integer of 0-10, and m is an integer of 1-3.

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