发明名称 LED PACKAGE WITH DOWNWARDLY RELFECTIVE SURFACE
摘要 PURPOSE: A LED package with downwardly reflective surface is provided to increase the intensity of radiation in a center outer area by using interaction of an upward reflection unit and downward reflection unit. CONSTITUTION: A downward reflection unit(32) is formed on LED chip. The downward reflection unit reflects a portion of light coming from the LED chip to the outside of a central area. A sealing member(30) has a lens surface formed on the outside of a center. An upward reflection unit(22) supports the LED chip. The upward reflection unit reflects light via the downward reflection unit and the sealing member.
申请公布号 KR20120079458(A) 申请公布日期 2012.07.12
申请号 KR20120069062 申请日期 2012.06.27
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 JEONG, CHAN SUNG
分类号 H01L33/60;H01L33/48;H01L33/52 主分类号 H01L33/60
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