发明名称 |
LED PACKAGE WITH DOWNWARDLY RELFECTIVE SURFACE |
摘要 |
PURPOSE: A LED package with downwardly reflective surface is provided to increase the intensity of radiation in a center outer area by using interaction of an upward reflection unit and downward reflection unit. CONSTITUTION: A downward reflection unit(32) is formed on LED chip. The downward reflection unit reflects a portion of light coming from the LED chip to the outside of a central area. A sealing member(30) has a lens surface formed on the outside of a center. An upward reflection unit(22) supports the LED chip. The upward reflection unit reflects light via the downward reflection unit and the sealing member.
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申请公布号 |
KR20120079458(A) |
申请公布日期 |
2012.07.12 |
申请号 |
KR20120069062 |
申请日期 |
2012.06.27 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
JEONG, CHAN SUNG |
分类号 |
H01L33/60;H01L33/48;H01L33/52 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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